Best Component

2019 Global Industrial Electronics Chip Market Analysis, Electronics and Electronics Applications, Competitive Strategy Report

2019 Global Industrial Electronics Chip Market Analysis, Electronics and Electronics Applications, Competitive Strategy Report

 

The global "Industrial Electronics Chip Market 2019" report is a meticulous study of the global industrial electronics chip market, depicting the most advanced details on the market. It also predicts growth in the coming years. Industrial electronic chip market analysis, scale, regional outlook, competitive strategy and forecast in 2025

 

The main players in the global industrial electronics chip market are Intel, Qualcomm, Samsung Electronics, SK Hynix, Micron Technology, Toshiba, Texas Instruments, Broadcom, STMicroelectronics, Media Tek, Renesas, SanDisk, Infibeam, Avago Terchnologies, NXP Advance Micro Devices (AMD), Sony, Freescale Semiconductor, nVidia, Marvell Technologies Group, ON Semiconductor, Analog Devices, Apple, HiSilicon, ROHM.

 

Main product segmentation - digital chip, analog chip

 

Application categories and market segments - Automotive, Mmedical Electronics, Military, Aerospace, and others are estimated with the help of in-depth market research. It also highlights the impact of Porter's five forces on market expansion. The industrial electronic chip market research analyzes the global industrial electronic chip market. In addition, the report analyzes the global industrial electronics chip market based on product type and customer base.

 

Intel is expanding its advanced packaging library to rebuild its leading position in chip manufacturing technology. Intel introduced three new technologies for building chips from smaller silicon and increasing the bandwidth between them in the package. The announcement of the cooperation EMIB, ODI and MDIO was released last week before the SemiCon West conference.

Texas Instruments: Improving the efficiency of solar inverter design

 

Texas Instruments' UCC21220 basic isolated gate driver improves these integration benefits by providing leading-edge performance for propagation delay and delay matching between the high and low sides. These timing characteristics reduce the losses associated with the switch because it is faster to turn on, while also minimizing the on-time of the body diode, thereby increasing efficiency. These parameters are also less dependent on VDD, so the voltage tolerance design margin for the rest of the system can be relaxed.

 

UCC21220 provides an alternative to solar applications, such as micro-inverters and solar optimizers, where basic isolation may be sufficient. The UCC21220 uses second-generation capacitive isolation technology to reduce cost through chip shrinkage, not only by providing typical propagation delays of 28ns, but also by reducing printed circuit board (PCB) space and system cost.

 

Higher efficiency means not only less energy wastage, but also smaller radiators, less cooling requirements, and a more compact and cost-effective design. Using the right high-voltage gate drivers can help achieve higher efficiency while reducing system cost in space-constrained micro-inverter or solar optimizer designs.

STMicroelectronics and Arrow Electronics jointly launch an electronically controlled fuel injection system reference design that meets new emissions regulations for small engines

 

The automotive industry is going to comply with the upcoming emissions regulations for single- and dual-cylinder fuel engines. For this reason, STMicroelectronics and Arrow Electronics have jointly introduced an electronically controlled fuel injection electronic control unit and provided a complete reference design. The SPC5-L9177A-K02 electronic control unit reference design scheme is applicable to motorcycles, scooters, three-wheeled vehicles, etc., which are subject to the forthcoming Euro 5, BSVI, 5th emission standards and other higher standards. Generators, marine engines, agricultural engines, etc. using electronically controlled fuel injection electronic control units.

 

The core components of this reference design include: automotive power microcontrollers with SPC57 2L Line 32-bit Power System Architecture®, and power, interface, and load actuators with L9177A highly integrated circuits for related applications Specially designed with market demand. This reference design also includes STMicroelectronics' STGD18N40 IGBT and L9616 CAN interface integrated circuit.

The SPC57 2L Line is part of the 32-bit Automotive Microcontroller (MCU) family designed to manage the chassis, gearbox, steering and braking systems of four-cylinder gasoline and diesel engines. It includes an intelligent universal timing module (GTM), 16-bit input and 56-bit output channels, 1.5MB of read and write flash memory for analog EEPROM, 64KB general-purpose static memory, two digital speckle interference (DSPI) modules, and an enhanced version. Analog to digital converter system with self-test function.

 

The L9177A includes a power supply and an actuator that can drive a two-cylinder internal combustion engine that takes advantage of ST's proprietary BCD process to integrate logic and power circuits onto a single die. It includes a 300mA/5V thermal shutdown stabilizer, a 5V tracking regulator with battery short circuit protection, two low on-resistance valve actuations, a stepper motor for engine idle speed control, and an oxygen sensing heater. And has a comprehensive self-diagnosis function.

 

Toshiba launches new miniature NVMe SSD design

 

Toshiba introduced a new NVMe SSD design that is small enough to replace a soldered BGA solid state drive. The new XFMEXPRESS form factor allows for two or four PCIe channels while taking up much less space than the smallest M.2 22x30mm card size. The size of the XFMEXPRESS card is 18x14x1.4mm, which is larger and thicker than the microSD card. Covers an area of up to 22.2x17.75x2.2mm. In contrast, the standard size of the BGA SSD is 11.5x13mm, PCIe x2 interface or 16x20mm with PCIe x4 interface.

 

XFMexpress is designed to bring the benefits of replaceable storage to devices that typically use BGA SSD or EMMC and UFS modules. For consumer devices, this opens the way for aftermarket upgrades, which allow for smaller overall sizes for embedded devices that require maintenance. Equipment manufacturers have also gained some flexibility in the supply chain because storage capacity can be adjusted later in the assembly process. XFMexpress is not intended to be used as an externally accessible slot, such as an SD card; swap out XFMexpress

The SSD needs to open the shell of the device it is installed on, but unlike the M.2 SSD, the XFMexpress slot and retention mechanism itself does not require tools.

 

  XFMEXPRESS hopes to allow performance similar to BGA SSD. The PCIe x4 host interface usually does not become a bottleneck, especially in the near future, BGA SSDs begin to adopt PCIe gen4, which is supported by the XFMEXPRESS connector. In contrast, these small-sized solid-state drives are often thermally limited, and the XFMEXPRESS connector is designed to allow the metal cover to dissipate heat as a heat sink. Toshiba cooperated with Japan Aerospace Electronics Co., Ltd. (JAE) to develop and manufacture XFMEXPRESS connectors.

 

The Global Industrial Electronics Chip Research Report provides data collected from various regulatory agencies covering key product and application categories and market segments. These data take into account the geographic regions of the industry and industry players who appear to have gained a strong position in the industrial electronics chip market.